ELECTRONIC MICROSCOPY PRODUCTS
Dual Beam FIB Microscopes
FIB microscopes; As they are popularly known, they combine the electron beam column with a second ion beam column. TESCAN, with more than 300 FIBs installed, is a pioneer in the field of focused ion microscopy. Its merger in 2013 with the world leader in the design and manufacture of ion columns and gas injection systems Orsay Physics has placed TESCAN ORSAY HOLDING at the forefront of development in this market.
TESCAN provides FIB systems with LIMS liquid metal ion sources (typically Ga) and plasma sources (typically xenon), which can be combined with a wide range of analytical techniques including EDS, WDS, EBSD and even TOF-SIMS or RAMAN.
Preparação de microamostras mecânicas com precisão ultrafina para ensaios de mecânica de fratura.
They are intended for advanced ultrathin sample preparation for TEM and other demanding nanofabrication tasks. Tasks that require definitive resolution and cutting-edge technology in ion optics and nanofabrication tools.
They incorporate the Orage™ high-performance Ga ion FIB column for maximum precision in nanoengineering that offers not only the highest standard of precision for nanofabrication (2.5 nm) but also the possibility of using high ion beam currents; (100nA).
The excellent resolution and performance at low energies of the ion beam allow the preparation of transparent coverslips for sub-20 nm semiconductor devices with the best quality.
Gallium FIBs will be the preferred option for preparing the thinnest, highest resolution lamellae or for nanofabrication of FIB elements with the highest possible resolution. They are also indicated for high-resolution 3D tomography, 5 nm isometric voxel, in small sample volumes.
Xenon plasma FIBs differ from classical gallium FIBs originating from a liquid source of metal ions by their ability to focus a greater number of ions in the beam, thus achieving much higher currents than can be obtained with a LIMS source . This capability allows much higher beam currents (up to 1 uA) to be achieved, enabling significantly higher milling speeds.
FIB plasma has other advantages associated with the larger size of its ions, as they reduce their penetration into the material to be milled, thus reducing the interaction volume and increasing the interaction zone of each ion in the plane, thus increasing the removal speed of each ion. Furthermore, the reactivity of xenon ions is much lower than that of Ga ions, minimizing the problem of contamination due to ion implantation.
With plasma FIBs, we sacrifice resolution as the minimum spot size is 15 nm (2.5 nm for Ga), but we can work effectively with much larger areas of the sample and remove material several orders of magnitude faster. Therefore, plasma ions will be the preferred option for 3D tomography work using FIB.
TESCAN AMBER features a magnetic field-free SEM column for ultra-high resolution measurements with excellent performance, particularly at low electron beam energies, with a column detector system providing better contrasts and improving sensitivity at the sample surface.
TESCAN FIB Dual Beam Solutions
TESCAN AMBER 2
Versatile nanoanalytical FIB-SEM to expand your materials research capabilities.
TESCAN AMBER 2 X
A unique combination of Plasma FIB and fieldless UHR FE-SEM for multi-scale materials characterization.
TESCAN SOLARIS X
A Plasma FIB-SEM platform for deep sectioning and the highest resolution for failure analysis in microelectronics.
TESCAN AMBER 2 CRYO
An alternative solution to prepare cryogenic slides for your TEM.
TESCAN SOLARIS Microeletrónica
A great alternative for the semi-automatic preparation of high-quality coverslips.
TESCAN SOLARIS BIO
Advanced UHR FIB-SEM for 2D and 3D characterization of your biological samples.